JETCOOL Develops Advanced Cooling Technology, Revolutionizing Electronics Design!

By StartUp City | Wednesday, July 31, 2019

The advanced cooling technology will enable chip manufacturers and semiconductor companies to build their heat sink units directly into the silicon substrates of their devices.

FREMONT, CA: Efficient cooling systems are imperative for electronic systems to run the devices safely and increase their efficiency. JETCOOL, a rising tech startup, recently unveiled its innovative solution designed to facilitate active cooling for power electronics. Its revolutionary technology shows potential in applications, including aerospace, elective vehicles, and AI data centers. Owing to its contributions to technology, IEEE International Microwave Symposium (IMS) named JETCOOL as the Next Top Startup.

JETCOOL unveiled its cooling solutions portfolio at the IMS in Boston. The symposium is a forum for the latest practices and advances in the field and attracts the world’s leading radio frequency (RF) and microwave professionals. The 2019 event hosted over 9400 guests and 600 companies showcasing their latest products. JETCOOL also won the Audience Choice Award for the Best New Tech Startup. The JETCOOL technology will enable tech companies to build a heat sink directly into the silicon substrate.

The technology backing the JETCOOL solution was developed at MIT Lincoln Laboratory. The research and development team successfully developed and characterized the microjet cooling modules for advanced electronics. Two of the team members formed JETCOOL in 2019, enhancing the robust collection technology for new application areas.

The microconvective cooling technology leverages small fluid jets built within the electronic devices. It offers results ten times better than the most advanced cooling solutions in the market today. It will significantly aid high-power semiconductor companies in enhancing the capabilities of their products. The solution is designed for advanced high-power processors, power amplifiers, and laser diodes. The compact structure eliminates the need for bulky heat sinks. It offers considerably better performance than the conventional cold plates, even with warm coolants, which can reduce HVAC usage and cost.

Multiple electronic systems stand to benefit from the offering of JETCOOL, which will enable them to push the limits of performance and increase their reliability. It will also increase device efficiency and stability, leading to the extension of the device lifetime. Its solutions are not only compact, but also offer enhanced cooling for heavy-duty electronics in aerospace, electric vehicles, and AI/ML processing

Weekly Brief