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Inpria is the brainchild of Oregon State University. The organization will use the newly raised capital to add jobs in business development, manufacturing, and customer support areas
Fremont, CA: Inpria, a leader in high-resolution metal oxide photoresists design for extreme ultraviolet lithography (EUV) has raised $31 million in Series C round of financing. The fund was raised from a broad syndicate representing leaders from across the semiconductor manufacturing ecosystem. The Series C financing round was led by existing investor and photoresists manufacturer, JSR Corporation. New investors included TSMC Partners and SK Hynix Inc. Apart from these venture capital firms, existing investors Air Liquide Venture Capital ALIAD, Applied Ventures, Intel Capital, and Samsung Venture Investment Corporation have also participated in the funding round.
"Inpria is the world leader in metal oxide photoresists for advanced EUV lithography process," said Mark Slezak, President of JSR Micro and new Inpria Board Director. "We are excited to expand our partnership with Inpria as we collaborate with them on quality and overall market acceptance" he added.
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Inpria photoresists, comprised of tin-oxide nanoclusters, deliver higher resolution with building blocks a fraction of the dimensions of traditional polymer-based resists, which are tuned to optimally absorb EUV photons. With unparalleled etch selectivity, Inpria photoresists enable simpler manufacturing flows and bigger process windows for an overall reduction in the cost of ownership. Inpria recently brought online its high-volume factory to support the initial production ramp for patrons.
Inpria CEO Andrew Grenville pointed out that the heavyweight industry participation in the round shows the importance of the company’s technology. Inpria is the brainchild of Oregon State University. The organization will use the newly raised capital to add jobs in business development, manufacturing, and customer support areas.
"We believe our investor participation serves as an indicator for Inpria's strategic significance to the semiconductor industry. We are delighted that our investor base now includes all semiconductor manufacturers worldwide that are currently adopting EUV patterning. This achievement is complemented by the strong participation of photoresist, equipment, and industrial chemical manufacturer investors as well," added Andrew Grenville, CEO of Inpria. "We look forward to working with our global partners to deliver a breakthrough EUV photoresist platform to the industry."
Inpria Corporation is the pioneer in metal oxide photoresist design, development, and manufacturing. Inpria's EUV photoresists enable semiconductor manufacturers to realize the full potential of EUV lithography.
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